ASE Technology Holding Co., Ltd.

ASX
$38.41 -1.03 (-2.60%)
Dividend Yield 1.09%
Payout Frequency Yearly

Dividend History

🎉 Upcoming Dividend

Investors can expect a dividend payout of $0.42 per share, scheduled to be distributed in 20 days on August 7, 2026

Pay DateAmountEx-DateRecord Date
August 7, 2026$0.422026-07-062026-07-06
August 6, 2025$0.362025-07-022025-07-02
August 5, 2024$0.322024-07-022024-07-02
August 3, 2023$0.562023-06-302023-07-03
August 4, 2022$0.472022-06-292022-06-30

Dividends Summary

Company News

High-End Semiconductor Packaging Market Size to Hit USD 134.90 Billion by 2035 | SNS Insider
GlobeNewswire Inc. • Sns Insider • March 13, 2026

The global high-end semiconductor packaging market is valued at USD 40.10 billion in 2025 and is expected to grow at a CAGR of 12.91% through 2035, reaching USD 134.90 billion. Growth is driven by increasing demand for AI processors, high-performance computing, data centers, and advanced consumer electronics. Asia-Pacific dominates with 68.4% mar...

Heterogeneous Integration Market Size to Grow USD 13.79 Billion by 2033 | Report by SNS Insider
GlobeNewswire Inc. • Sns Insider • January 16, 2026

The U.S. heterogeneous integration market is estimated at USD 0.47 billion in 2025 and is projected to grow at a CAGR of 22.99% through 2033, reaching USD 2.47 billion. Growth is driven by increasing demand for advanced semiconductor packaging to support AI, high-performance computing, 5G, and defense applications. However, manufacturing complexi...

Trends in Advanced Packaging Market 2025-2035
GlobeNewswire Inc. • Towards Packaging • December 15, 2025

The global advanced packaging market is expected to grow from USD 40.34 billion in 2025 to USD 78.75 billion by 2034, driven by rising demand for high-performance computing, AI, 5G devices, and compact electronics, with North America leading technological advancements.

AI Isn't Slowing -- It's Bottlenecked. TSMC Just Told Us Where.
The Motley Fool • Beegee Alop • November 17, 2025

The AI semiconductor industry is experiencing a bottleneck in advanced packaging capacity, not silicon production. TSMC remains central to AI chip manufacturing, with demand continuing to outpace supply, particularly in premium chip packaging technologies.

Organic Substrate Packaging Materials Market Size, Trends, Segments, Share and Companies 2025-35
GlobeNewswire Inc. • Towards Packaging • November 14, 2025

The global organic substrate packaging materials market is expected to grow from $17.40 billion in 2025 to $28.41 billion by 2034, driven by demand for miniaturized electronics, semiconductor packaging, and 5G technologies, with Asia-Pacific leading market expansion.

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